IBM Intel Xeon L5420 44E5137 User Manual
Product codes
44E5137
Thermal/Mechanical Reference Design
28
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or
for the Thermal Profile A and Thermal Profile B specifications.
of this document also provides details on the 2U+ and 1U Intel reference thermal
solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile A and Thermal Profile B respectively.
solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile A and Thermal Profile B respectively.
2.2.7.2
Thermal Profile Concept for the
Quad-Core Intel® Xeon® Processor
E5400/X5482 Series
The Quad-Core Intel® Xeon® Processor E5400 Series is designed to go into various
form factors, including the volumetrically constrained 1U and custom blade form
factors. The Quad-Core Intel® Xeon® Processor X5482 is designed to go into
volumetrically unconstrained workstation platforms only. Intel has developed single
thermal profile for E5400/X5482 Series.
form factors, including the volumetrically constrained 1U and custom blade form
factors. The Quad-Core Intel® Xeon® Processor X5482 is designed to go into
volumetrically unconstrained workstation platforms only. Intel has developed single
thermal profile for E5400/X5482 Series.
Designing to the Thermal Profile ensures that no measurable performance loss due to
Thermal Control Circuit (TCC) activation is observed in the processor. It is expected
that TCC would only be activated for very brief periods of time when running a worst-
case real world application in a worst-case thermal condition. These brief instances of
TCC activation are not expected to impact the performance of the processor. A worst
case real world application is defined as a commercially available, useful application
which dissipates a power equal to, or above, the TDP for a thermally relevant
timeframe. One example of a worst-case thermal condition is when a processor local
ambient temperature is at or above 43.2°C for Quad-Core Intel® Xeon® Processor
E5400 Series Thermal Profile.
Thermal Control Circuit (TCC) activation is observed in the processor. It is expected
that TCC would only be activated for very brief periods of time when running a worst-
case real world application in a worst-case thermal condition. These brief instances of
TCC activation are not expected to impact the performance of the processor. A worst
case real world application is defined as a commercially available, useful application
which dissipates a power equal to, or above, the TDP for a thermally relevant
timeframe. One example of a worst-case thermal condition is when a processor local
ambient temperature is at or above 43.2°C for Quad-Core Intel® Xeon® Processor
E5400 Series Thermal Profile.
Thermal solutions that exceed the Thermal Profile specification are considered
incompliant and will adversely affect the long-term reliability of the processor.
incompliant and will adversely affect the long-term reliability of the processor.
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or
for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile
specifications.
and
of this document provide details on 1U Intel
reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon®
Processor E5400 Series Thermal Profile.
Processor E5400 Series Thermal Profile.
2.2.8
Performance Targets
The Thermal Profile specifications for this processor are published in the Quad-Core
Intel® Xeon® Processor 5400 Series Datasheet. These Thermal Profile specifications
are shown as a reference in the subsequent discussions.
Intel® Xeon® Processor 5400 Series Datasheet. These Thermal Profile specifications
are shown as a reference in the subsequent discussions.