IBM Intel Xeon L5420 44E5137 User Manual

86

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

For the heatsink clip load measurement, use equivalent test equipment to the one 
listed 

1.

Select load range depending on expected load level. It is usually better, whenever possible, to operate in 

the high end of the load cell capability. Check with your load cell vendor for further information.

2.

Since the load cells are calibrated in terms of mV/V, a data logger or scanner is required to supply 5 volts 

DC excitation and read the mV response. An automated model will take the sensitivity calibration of the 

load cells and convert the mV output into pounds.

3.

With the test equipment listed above, it is possible to automate data recording and control with a 6101-PCI 

card (GPIB) added to the scanner, allowing it to be connected to a PC running LabVIEW* or Vishay's 

StrainSmart* software. 

4.

IMPORTANT: In addition to just a zeroing of the force reading at no applied load, it is important to 

calibrate the load cells against known loads. Load cells tend to drift. Contact your load cell vendor for 

calibration tools and procedure information.

5.

When measuring loads under thermal stress (bake for example), load cell thermal capability must be 

checked, and the test setup must integrate any hardware used along with the load cell. For example, the 

Model 13 load cells are temperature compensated up to 71 °C, as long as the compensation package 

(spliced into the load cell's wiring) is also placed in the temperature chamber. The load cells can handle up 

to 121 °C (operating), but their uncertainty increases according to 0.02% rdg/°F. 

The following sections give two examples of load measurement. However, this is not 
meant to be used in mechanical shock and vibration testing.

Any mechanical device used along with the heatsink attach mechanism will need to be 
included in the test setup (i.e., back plate, attach to chassis, etc.).

Prior to any test, make sure that the load cell has been calibrated against known loads, 
following load cell vendor’s instructions.

1. Pre-assemble mechanical components on the board as needed prior to mounting 

the motherboard on an appropriate support fixture that replicate the board attach 

to a target chassis.
For example: If the attach mechanism includes fixtures on the back side of the 
board, those must be included, as the goal of the test is to measure the load 
provided by the actual heatsink mechanism.

2. Install the test vehicle in the socket.
3. Assemble the heatsink reworked with the load cells to motherboard as shown for 

the Quad-Core Intel® Xeon® Processor 5400 Series CEK-reference heatsink 
example in 

, and actuate attach mechanism.

4. Collect continuous load cell data at 1 Hz for the duration of the test. A minimum 

time to allow the load cell to settle is generally specified by the load cell vendors 

Load cell
Notes: 1, 5

Honeywell*-Sensotec* Model 13 subminiature load cells, 

compression only
Select a load range depending on load level being tested.

 

AL322BL

Data Logger 

(or scanner)
Notes: 2, 3, 4

Vishay* Measurements Group Model 6100 scanner with a 

6010A strain card (one card required per channel).

Model 6100