Atmel Evaluation Kit AT91SAM9M10-G45-EK AT91SAM9M10-G45-EK Data Sheet
Product codes
AT91SAM9M10-G45-EK
1330
SAM9M10 [DATASHEET]
6355F–ATARM–12-Mar-13
This package respects the recommendations of the NEMI User Group.
48.2
Soldering Profile
Note:
It is recommended to apply a soldering temperature higher than 250°C
A maximum of three reflow passes is allowed per component.
Table 48-1.
Soldering Information
Ball Land
0.4 mm +/- 0.05
Soldering Mask Opening
0.275 mm +/- 0.03
Table 48-2.
Device and 324-ball TFBGA Package Maximum Weight
400
mg
Table 48-3.
324-ball TFBGA Package Characteristics
Moisture Sensitivity Level
3
Table 48-4.
Package Reference
JEDEC Drawing Reference
MO-210
JESD97 Classification
e1
Table 48-5.
Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
°C/sec. max.
Preheat Temperature 175°C ±25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
°C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260 +0
°C
Ramp-down Rate
6
°C/sec. max.
Time 25
°C to Peak Temperature
8 min. max.