Atmel ARM-Based Evaluation Kit for SAM4S16C, 32-Bit ARM® Cortex® Microcontroller ATSAM4S-WPIR-RD ATSAM4S-WPIR-RD Data Sheet
Product codes
ATSAM4S-WPIR-RD
SAM4S Series [DATASHEET]
Atmel-11100G-ATARM-SAM4S-Datasheet_27-May-14
1192
Figure 45-7.
UBM Pad Installation
This package respects the recommendations of the NEMI User Group.
Edge Ball Center to Center
D1
2.8 BSC
E1
2.8 BSC
Package Edge Tolerance
aaa
0.03
Coplanarity (Whole Wafer)
ccc
0.075
Ball/Bump Offset (Package)
ddd
0.05
Ball/Bump Offset (Ball)
eee
0.015
Table 45-20.
WLCSP Package Reference - Soldering Information (Substrate Level)
UBM Pad (Under Bump Metallurgy) (E)
200 µm
PBO2 Opening (j)
240 µm
Table 45-21.
Device and 64-ball WLCSP Package Maximum Weight
SAM4S
TBD
mg
Table 45-22.
64-ball WLCSP Package Characteristics
Moisture Sensitivity Level
1
Table 45-23.
64-ball WLCSP Package Reference
JEDEC Drawing Reference
Not JEDEC
JESD97 Classification
e1
Table 45-19.
64-ball WLCSP Package Dimensions (in mm)
Symbol
Common Dimensions
MIN.
NOM.
MAX.