Linear Technology LTM4624Y Demo Board, 14V, 4A Step-Down µModule Regulator DC1889A DC1889A Data Sheet
Product codes
DC1889A
LTM4624
6
4624fb
For more information
www.linear.com/LTM4624
PIN FUNCTIONS
COMP (A1): Current Control Threshold and Error Amplifier
Compensation Point. The current comparator’s trip thresh-
old is linearly proportional to this voltage, whose normal
range is from 0.3V to 1.8V. Tie the COMP pins together for
parallel operation. The device is internally compensated.
TRACK/SS (A2): Output Tracking and Soft-Start Input.
TRACK/SS (A2): Output Tracking and Soft-Start Input.
Allows the user to control the rise time of the output volt-
age. Putting a voltage below 0.6V on this pin bypasses the
internal reference input to the error amplifier, and servos
the FB pin to match the TRACK/SS voltage. Above 0.6V,
the tracking function stops and the internal reference
resumes control of the error amplifier. There’s an internal
2.5µA pull-up current from INTV
CC
on this pin, so putting
a capacitor here provides a soft-start function.
RUN (A3): Run Control Input of the Switching Mode
RUN (A3): Run Control Input of the Switching Mode
Regulator. Enables chip operation by tying RUN above
1.25V. Pulling it below 1.1V shuts down the part. Do not
leave floating.
FREQ (A4): Frequency is set internally to 1MHz. An ex-
FREQ (A4): Frequency is set internally to 1MHz. An ex-
ternal resistor can be placed from this pin to SGND to
increase frequency, or from this pin to INTV
CC
to reduce
frequency. See the Applications Information section for
frequency adjustment.
NC (A5, B2, B5): No Connect Pins. Pins are not connected
NC (A5, B2, B5): No Connect Pins. Pins are not connected
internally. Float or ground these pins.
FB (B1): The Negative Input of the Error Amplifier. Internally,
FB (B1): The Negative Input of the Error Amplifier. Internally,
this pin is connected to V
OUT
with a 60.4k precision resis-
tor. Different output voltages can be programmed with an
additional resistor between the FB and SGND pins. Tying
the FB pins together allows for parallel operation. See the
Applications Information section for details.
GND (B3, C3, D3-D4, E3): Power Ground Pins for Both
Input and Output Returns.
SGND (B4): Signal Ground Connection. Tie to GND with
SGND (B4): Signal Ground Connection. Tie to GND with
minimum distance. Connect FREQ resistor, COMP com-
ponent, MODE, TRACK/SS component, FB resistor to this
pin as needed.
V
V
OUT
(C1, D1-D2, E1-E2): Power Output Pins. Apply out-
put load between these pins and GND pins. Recommend
placing output decoupling capacitance directly between
these pins and GND pins.
PGOOD (C2): Output Power Good with Open-Drain Logic.
PGOOD (C2): Output Power Good with Open-Drain Logic.
PGOOD is pulled to ground when the voltage on the FB pin
is not within ±10% of the internal 0.6V reference.
MODE (C4): Operation Mode Select. Tie this pin to INTV
MODE (C4): Operation Mode Select. Tie this pin to INTV
CC
to force continuous synchronous operation at all output
loads. Tying it to SGND enables discontinuous mode
operation at light loads. Do not leave floating.
SV
SV
IN
(C5): Signal V
IN
. Filtered input voltage to the on-chip
3.3V regulator. Tie this pin to the V
IN
pin in most applica-
tions. Connect SV
IN
to an external voltage supply of at
least 4V which must also be greater than V
OUT
.
V
IN
(D5, E5): Power Input Pins. Apply input voltage be-
tween these pins and GND pins. Recommend placing
input decoupling capacitance directly between V
IN
pins
and GND pins.
INTV
INTV
CC
(E4): Internal 3.3V Regulator Output. The internal
power drivers and control circuits are powered from this
voltage. This pin is internally decoupled to GND with a 1µF
low ESR ceramic capacitor.
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY.