On Semiconductor NCP3065 Evaluation Board NCP3065D1SLDGEVB NCP3065D1SLDGEVB NCP3065D1SLDGEVB Data Sheet

CASE 488AF−01

ISSUE C

ÉÉÉ

ÉÉÉ

NOTES:

1. DIMENSIONS AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. DETAILS A AND B SHOW OPTIONAL

CONSTRUCTIONS FOR TERMINALS.

0.80

1.00

0.00

0.05

0.20 REF

0.25

0.35

4.00 BSC

1.91

2.21

4.00 BSC

2.09

2.39

0.80 BSC

0.20

−−−

0.30

0.50

C

0.15

C

0.15

Ç

ÇÇ

Ç

Ç

ÇÇ

Ç

Ç

C

0.08

C

0.10

Ç

Ç

Ç

ÇÇ

ÇÇ

Ç

Ç

Ç

Ç

0.10 C

0.05 C

A B

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

8X

0.63

2.21

2.39

8X

0.80

PITCH

4.30

0.35

ÉÉ

ÇÇ

ÇÇ

ÉÉ

ÉÉ

−−−

0.15

DIMENSIONS: MILLIMETERS

PACKAGE

OUTLINE

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