On Semiconductor NCP1422 Evaluation Board NCP1422LEDGEVB NCP1422LEDGEVB Data Sheet
Product codes
NCP1422LEDGEVB
NCP1422
http://onsemi.com
3
PIN FUNCTION DESCRIPTIONS
Pin
Symbol
Description
1
FB
Output Voltage Feedback Input.
2
LBI/EN
Low−Battery Detector Input and IC Enable. With this pin pulled down below 0.5 V, the device is disabled and
enters the shutdown mode.
enters the shutdown mode.
3
LBO
Open−Drain Low−Battery Detector Output. Output is LOW when V
LBI
is < 1.20 V. LBO is high impedance in
shutdown mode.
4
NC
No Connect Pin
5
REF
1.20 V Reference Voltage Output, bypass with 300 nF capacitor. If this pin is loaded, bypass with 1.0
F
capacitor; this pin can be loaded up to 2.5 mA @ V
OUT
= 3.3 V.
6
BAT
Battery input connection for internal ring−killer.
7
GND
Ground.
8
LX
N−Channel and P−Channel Power MOSFET drain connection.
9
NC
No Connect Pin
10
OUT
Power Output. OUT also provides bootstrap power to the device.
MAXIMUM RATINGS
(T
A
= 25
°
C unless otherwise noted.)
Rating
Symbol
Value
Unit
Power Supply (Pin 10)
V
OUT
−0.3, 5.5
V
Input/Output Pins (Pin 1−3, Pin 5−8)
V
IO
−0.3, 5.5
V
Thermal Characteristics
DFN−10 Plastic Package
Thermal Resistance Junction−to−Air (Note 5)
Thermal Resistance Junction−to−Air (Note 5)
P
D
R
JA
1824
68.5
mW
_
C/W
Operating Junction Temperature Range
T
J
−40 to +150
_
C
Operating Ambient Temperature Range
T
A
−40 to +85
_
C
Storage Temperature Range
T
stg
−55 to +150
_
C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values
(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
1. This device contains ESD protection and exceeds the following tests:
(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage
may occur and reliability may be affected.
1. This device contains ESD protection and exceeds the following tests:
Human Body Model (HBM)
±
2.0 kV per JEDEC standard: JESD22−A114. *Except OUT pin, which is 1k V.
Machine Model (MM)
±
200 V per JEDEC standard: JESD22−A115. *Except OUT pin, which is 100 V.
2. The maximum package power dissipation limit must not be exceeded.
PD
+
TJ(max)
*
TA
R
JA
3. Latchup Current Maximum Rating:
±
150 mA per JEDEC standard: JESD78.
4. Moisture Sensitivity Level: MSL 1 per IPC/JEDEC standard: J−STD−020A.
5. Measured on approximately 1x1 inch sq. of 1 oz. Copper.
5. Measured on approximately 1x1 inch sq. of 1 oz. Copper.