On Semiconductor NCP5030 Evaluation Board NCP5030MTTXGEVB NCP5030MTTXGEVB NCP5030MTTXGEVB Data Sheet
Product codes
NCP5030MTTXGEVB
NCP5030
http://onsemi.com
14
PACKAGE DIMENSIONS
WDFN12, 3x4, 0.5P
CASE 506AY−01
ISSUE B
ÈÈÈÈ
ÈÈÈÈ
ÈÈÈÈ
PIN 1
INDEX AREA
A
B
C
0.10
C
0.10
2X
2X
A
C
C
0.08
12X
C
0.10
SIDE VIEW
TOP VIEW
E2
D2
BOTTOM VIEW
e
b
12X
L
1
6
12
7
D
E
A3
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
MIN
MAX
MILLIMETERS
A
0.70
0.80
A1
0.00
0.05
A3
0.20 REF
b
0.20
0.30
D
4.00 BSC
D2
3.20
3.40
E
3.00 BSC
E2
1.60
1.80
e
0.50 BSC
K
0.20
−−−
L
0.30
0.50
0.10
B
0.05
A
C
C
NOTE 3
12X
K
12X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
3.30
12 X
1.75
0.55
12 X
0.30
3.35
0.50 PITCH
DIMENSIONS: MILLIMETERS
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