Quickcool Radio modules CARD-MF1K-ISO-PVC Data Sheet
Product codes
CARD-MF1K-ISO-PVC
MF1S50YYX
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196330
31 of 39
NXP Semiconductors
MF1S50yyX
MIFARE Classic 1K - Mainstream contactless smart card IC
14.3 Bare die outline
Fig 23. Bare die outline MF1S50yyX
typ.659,0
(1)
typ. 694,0
(1)
240,8
46,5
574,5
609,5
typ. 19,0
(1)
min.5,0
typ. 19,0
(1)
min.5,0
Bump size
x [mm]
x [mm]
LA, LB, VSS, TEST
66
66
Chip Step
MF1S50yyX
LB
VSS
LA
TESTIO
X
Y
46,5
(1) the air gap and thus the step size may vary due to varying foil expansion
(2) all dimensions in mm, pad locations measured from metal ring edge (see detail)
659
(1)
694
(1)
001aan924