STMicroelectronics VND5T035AK Evaluation Board EV-VND5T035AK EV-VND5T035AK Data Sheet
Product codes
EV-VND5T035AK
EV-VND5T035AK
Thermal data
Doc ID 023987 Rev 2
3/9
2 Thermal
data
Table 2.
VND5T035AK-E thermal data
Symbol
Parameter
Max. value
Unit
R
thj-amb
Thermal resistance junction-ambient (MAX)
29
°C/W
Table 3.
PCB specifications
Parameter
Value
Unit
Board dimensions
38 x 43
mm
Number of Cu layer
2
—
Layer Cu thickness
70
µm
Board finish thickness
1.6 +/- 10%
mm
Board Material
FR4
—
Thermal vias separation
1.2
mm
Thermal vias diameter
0.3 /- 0.08
mm