Nxp Semiconductors BU2527AX BU Transistor NPN SOT 399 (TOP 3D) 12A 800V BU2527AX Data Sheet

Product codes
BU2527AX
Page of 7
Philips Semiconductors
Product specification
 Silicon Diffused Power Transistor
BU2527AX 
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in
horizontal deflection circuits of high resolution monitors. Features improved RBSOA performance and is suitable for
operation up to 64 kHz.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE
 = 0 V
-
1500
V
V
CEO
Collector-emitter voltage (open base)
-
800
V
I
C
Collector current (DC)
-
12
A
I
CM
Collector current peak value
-
30
A
P
tot
Total power dissipation
T
hs
 
 25 ˚C
-
45
W
V
CEsat
Collector-emitter saturation voltage
I
C
 = 6.0 A; I
B
 = 1.2 A
-
5.0
V
I
Csat
Collector saturation current
6.0
-
A
t
s
Storage time
I
Csat
 = 6.0 A; I
B(end)
 = 0.55 A
1.7
2.0
µ
s
PINNING - SOT399
PIN CONFIGURATION
SYMBOL
PIN
DESCRIPTION
1
base
2
collector
3
emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CESM
Collector-emitter voltage peak value
V
BE
 = 0 V
-
1500
V
V
CEO
Collector-emitter voltage (open base)
-
800
V
I
C
Collector current (DC)
-
12
A
I
CM
Collector current peak value
-
30
A
I
B
Base current (DC)
-
8
A
I
BM
Base current peak value
-
12
A
-I
B(AV)
Reverse base current
average over any 20 ms period
-
200
mA
-I
BM
Reverse base current peak value 
1
-
7
A
P
tot
Total power dissipation
T
hs
 
  25 ˚C
-
45
W
T
stg
Storage temperature
-55
150
˚C
T
j
Junction temperature
-
150
˚C
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
R
th j-hs
Junction to heatsink
without heatsink compound
-
3.7
K/W
R
th j-hs
Junction to heatsink
with heatsink compound
-
2.8
K/W
R
th j-a
Junction to ambient
in free air
35
-
K/W
case
1 2 3
b
c
e
Turn-off current.
September 1997
1
Rev 2.200