Infineon Technologies N/A BC 850-BW NPN Case type SOT 23 I(C BC850BW Data Sheet
Product codes
BC850BW
2011-09-09
12
BC847...-BC850...
Package TSLP-3-1
2
3
1
0.4
+0.1
BFR193L3
Type code
Type code
Pin 1 marking
Laser marking
0.76
4
1.16
0.5
Pin 1
marking
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
P a c k a g e O u t l i n e
F o o t P r i n t
M a r k i n g L a y o u t ( E x a m p l e )
S t a n d a r d P a c k i n g
Stencil apertures
Copper
Solder mask
0.275
0.2
0.315
0.945
0.45
0.17
0.355
0.2
0.35
0.225
1
0.6
0.225
0.15
0.35
0.3
R0.1
1
2
±0.05
0.35
±0.035
2 x 0.15
1)
Top view
Bottom view
1) Dimension applies to plated terminal
±0.035
0.5
1)
±0.05
0.6
3
±0.05
0.65
±0.035
2x
0.25
1)
±0.035
0.25
1)
1
±0.05
Pin 1
marking
marking
0.05 MAX.