On Semiconductor N/A MJE 18004 NPN Case type TO 220 AB I(C) MJE18004G Data Sheet

©  Semiconductor Components Industries, LLC, 2013

Publication Order Number:

MJE18004G, MJF18004G
SWITCHMODE

The MJE/MJF18004G have an applications specific state−of−the−art

die designed for use in 220 V line−operated SWITCHMODE Power
supplies and electronic light ballasts.

•

Improved Efficiency Due to Low Base Drive Requirements:

♦

High and Flat DC Current Gain h

FE

♦

Fast Switching

♦

No Coil Required in Base Circuit for Turn−Off (No Current Tail)

•

Full Characterization at 125

_C

•

ON Semiconductor Six Sigma Philosophy Provides Tight and

Reproducible Parametric Distributions

•

Two Package Choices: Standard TO−220 or Isolated TO−220

•

MJF18004, Case 221D, is UL Recognized at 3500 V

RMS

: File

#E69369

•

These Devices are Pb−Free and are RoHS Compliant*

Collector−Emitter Sustaining Voltage

V

CEO

450

Vdc

Collector−Base Breakdown Voltage

V

CES

1000

Vdc

Emitter−Base Voltage

V

EBO

9.0

Vdc

Collector Current

− Continuous

I

C

5.0

Adc

Collector Current

− Peak (Note 1)

I

CM

10

Adc

Base Current

− Continuous

I

B

2.0

Adc

Base Current

− Peak (Note 1)

I

BM

4.0

Adc

RMS Isolation Voltage (Note 2)

Test No. 1 Per Figure 22a

Test No. 2 Per Figure 22b

Test No. 3 Per Figure 22c

(for 1 sec, R.H. < 30%, T

A

 = 25_C)

V

ISOL

4500

3500

1500

V

Total Device Dissipation @ T

C

 = 25_C

MJE18004

MJF18004

Derate above 25°C

MJE18004

MJF18004

P

D

75

35

0.6

0.28

W

W/_C

Operating and Storage Temperature

T

J

, T

stg

−65 to 150

_C

Thermal Resistance, Junction−to−Case

MJE18004

MJF18004

R

qJC

1.65

3.55

_C/W

Thermal Resistance, Junction−to−Ambient

R

qJA

62.5

_C/W

Maximum Lead Temperature for Soldering

Purposes 1/8″ from Case for 5 Seconds

T

L

260

_C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.

2. Proper strike and creepage distance must be provided.

G

= Pb−Free Package

A

= Assembly Location

Y

= Year

WW

= Work Week

See detailed ordering and shipping information in the package

dimensions section on page 8 of this data sheet.

*For additional information on our Pb−Free strategy 

and soldering details, please download the

ON Semiconductor Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

1

2

3

MJE18004G

AYWW

3

1 2

MJF18004G

AYWW

4

1

BASE

3

EMITTER

COLLECTOR

2,4