Intel Core Duo T2350 LF80539GE0362ME User Manual

Datasheet

3

Introduction ..............................................................................................................7
1.1

Terminology .......................................................................................................9

Low Power Features ................................................................................................ 11
2.1

Clock Control and Low Power States .................................................................... 11
2.1.1

Core Low-Power States ........................................................................... 13
2.1.1.1

C0 State .................................................................................. 13

C1/AutoHALT Powerdown State .................................................. 13

Normal State............................................................................ 14

Stop-Grant State ...................................................................... 14

Stop Grant Snoop State ............................................................. 15

Sleep State .............................................................................. 15

Deep Sleep State ...................................................................... 16

Enhanced Intel SpeedStep® Technology .............................................................. 17

Electrical Specifications ........................................................................................... 21
3.1

Power and Ground Pins ...................................................................................... 21

FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21

Voltage Identification ......................................................................................... 21

Signal Terminations and Unused Pins ................................................................... 25

FSB Signal Groups............................................................................................. 25

CMOS Signals ................................................................................................... 27

Maximum Ratings.............................................................................................. 27

3.10 Processor DC Specifications ................................................................................ 28

Package Mechanical Specifications and Pin Information .......................................... 41
4.1

Package Mechanical Specifications ....................................................................... 41
4.1.1

Alphabetical Signals Reference ............................................................................ 49

Thermal Specifications and Design Considerations .................................................. 79
5.1

Thermal Specifications ....................................................................................... 85
5.1.1

Thermal Diode ....................................................................................... 85