Intel Core Duo T2350 LF80539GE0362ME User Manual

46

Datasheet

The processor may contain components on the substrate that define component keep-

out zone requirements. A thermal and mechanical solution design must not intrude into 

the required keep-out zones. Decoupling capacitors are typically mounted in the keep-

out areas. The location and quantity of the capacitors may change, but will remain 

within the component keep-in. See 

 for keep-out zones.

Maximum mechanical package loading specifications are given in 

These specifications are static compressive loading in the direction normal to the 

processor. This maximum load limit should not be exceeded during shipping conditions, 

standard use condition, or by thermal solution. In addition, there are additional load 

limitations against transient bend, shock, and tensile loading. These limitations are 

more platform specific, and should be obtained by contacting your field support. 

Moreover, the processor package substrate should not be used as a mechanical 

reference or load-bearing surface for thermal and mechanical solution.

The typical mass of the processor is given in 

. This mass includes 

all the components that are included in the package.