Intel Celeron D 345 NE80546RE083256 User Manual

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Commonly used terms are explained here for clarification:

• Intel

land Package— Processor in the FC-LGA6 package with a 512 KB L2 cache.

• Processor — For this document, the term processor is the generic form of the 

Celeron D processor.

• Keep-out zone — The area on or near the processor that system design can not 

use. 

 945G/945GZ/945P/945PL Express chipset family — Chipset that 

supports DDR and DDR2 memory technology for the Celeron D processor on 65 nm 

process.

• Processor core — Processor core die with integrated L2 cache. 
• LGA775 socket — The Celeron D processor on 65 nm process mates with the 

system board through a surface mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 

interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any 

mechanical features for heatsink attach, a retention mechanism is required. 

Component thermal solutions should attach to the processor via a retention 

mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to 

the chipset; also referred to as the processor system bus or the system bus. All 

memory and I/O transactions as well as interrupt messages pass between the 

processor and chipset over the FSB.

• Storage conditions — Refers to a non-operational state. The processor may be 

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 

exposed to free air. Under these conditions, processor lands should not be 

connected to any supply voltages, have any I/Os biased, or receive any clocks. 

Upon exposure to “free air”(i.e., unsealed packaging or a device removed from 

packaging material) the processor must be handled in accordance with moisture 

sensitivity labeling (MSL) as indicated on the packaging material.

• Functional operation — Refers to normal operating conditions in which all 

processor specifications, including DC, AC, system bus, signal quality, mechanical 

and thermal are satisfied.