Intel Celeron D 345 NE80546RE083256 User Manual

76

The case temperature is defined at the geometric top center of the processor. Analysis 

indicates that real applications are unlikely to cause the processor to consume 

maximum power dissipation for sustained time periods. Intel recommends that 

complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 instead of the maximum processor power consumption. The Thermal Monitor 

feature is designed to protect the processor in the unlikely event that an application 

exceeds the TDP recommendation for a sustained periods of time. For more details on 

the usage of this feature, refer to 

356

3.33

86

5

See 

1, 2

1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the

maximum power that the processor can dissipate.

2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.

Therefore, the maximum T

C

 will vary depending on the TDP of the individual processor. Refer to thermal profile

figure and associated table for the allowed combinations of power and T

C

.

352

3.2

86

5

, 

347

3.06

86

5

, 

365

3.66

65

5

See 

1, 2

360

3.46

65

5

1

, 

2

356

3.33

65

5

1

, 

2

352

3.2

65

5

1

, 

2

347

3.06

65

5

1

, 

2

1.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.

2.

This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the max-
imum T

C

 will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the

allowed combinations of power and T

C

.