Ept Type E - Female connector Content: 1 pc(s) 108-40064 Information Guide
Product codes
108-40064
82
ept GmbH
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Phone +49 (0) 88 61 / 25 01 0
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Fax +49 (0) 88 61 / 55 07
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E-mail sales@ept.de
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www.ept.de
Connectors according to DIN 41612 / IEC 60603-2
Hole specifi cations
Hole specifi cations
Plated through-hole according to IEC 60352-5
ept offers adapted press-fi t zones for
various new board surfaces.
various new board surfaces.
C female connector
Special version
B/C/D/R/M/F low
profi le/G low profi le/
VME64x
D/E/F/G
Nominal hole
Ø 0.85 mm
Ø 1.0 mm
Ø 1.6 mm
imm. Sn printed circuit boards
A
PCB thickness
min. 1.6 mm
min. 1.6 mm
min. 1.6 mm
B
Plated hole
Ø 0.85
+ 0.10/- 0.05 mm
Ø 1
+ 0.09/- 0.06 mm
Ø 1.6
+ 0.09/- 0.06 mm
C
Drill hole
1.0
± 0.025 mm
1.15
± 0.025 mm
1.75
± 0.025 mm
D
Cu plating
min. 25 μm
min. 25 μm
min. 25 μm
E
imm. Sn plating
max. 1.5 μm
max. 1.5 μm
max. 1.5 μm
F
Annular ring
min. 0.1 mm
min. 0.1 mm
min. 0.1 mm
Ni, Au printed circuit boards
A
PCB thickness
min. 1.6 mm
min. 1.6 mm
min. 1.6 mm
B
Plated hole
Ø 0.85
+ 0.10/- 0.05 mm
Ø 1
+ 0.09/- 0.06 mm
Ø 1.6
+ 0.09/- 0.06 mm
C
Drill hole
1.0
± 0.025 mm
1.15
± 0.025 mm
1.75
± 0.025 mm
D
Cu plating
min. 25 μm
min. 25 μm
min. 25 μm
E
Ni, Au plating
0.05 – 0.2 μm Au
more than 2.5 – 5 μm Ni
0.05 – 0.2 μm Au
more than 2.5 – 5 μm Ni
0.05 – 0.2 μm Au
more than 2.5 – 5 μm Ni
F
Annular ring
min. 0.1 mm
min. 0.1 mm
min. 0.1 mm
pure Cu printed circuit boards
A
PCB thickness
min. 1.6 mm
min. 1.6 mm
min. 1.6 mm
B
Plated hole
Ø 0.85
+ 0.10/- 0.05 mm
Ø 1
+ 0.09/- 0.06 mm
Ø 1.6
+ 0.09/- 0.06 mm
C
Drill hole
1.0
± 0.025 mm
1.15
± 0.025 mm
1.75
± 0.025 mm
D
Cu plating
min. 25 μm
min. 25 μm
min. 25 μm
E
OSP*
e. g. GLICOAT-SMD (F2)
with 0.12 – 0.15 μm
e. g. GLICOAT-SMD (F2)
with 0.12 – 0.15 μm
e. g. GLICOAT-SMD (F2)
with 0.12 – 0.15 μm
F
Annular ring
min. 0.1 mm
min. 0.1 mm
min. 0.1 mm
HAL Sn printed circuit boards
A
PCB thickness
min. 1.6 mm
min. 1.6 mm
min. 1.6 mm
B
Plated hole
Ø 0.85
+ 0.10/- 0.05 mm
Ø 1
+ 0.09/- 0.06 mm
Ø 1.6
+ 0.09/- 0.06 mm
C
Drill hole
1.0
± 0.025 mm
1.15
± 0.025 mm
1.75
± 0.025 mm
D
Cu plating
min. 25 μm
min. 25 μm
min. 25 μm
E
HAL Sn
5 – 15 μm
5 – 15 μm
5 – 15 μm
F
Annular ring
min. 0.1 mm
min. 0.1 mm
min. 0.1 mm
* OSP = Organic Solderabiltity Preservatives