IBM Intel Xeon E7430 44E4470 Data Sheet
Product codes
44E4470
Intel® Xeon® Processor 7400 Series Datasheet
61
Mechanical Specifications
3.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
3.5
Package Insertion Specifications
The Intel® Xeon® Processor 7400 Series can be inserted into and removed from a
mPGA604 socket 15 times. The socket should meet the mPGA604 requirements
detailed in the mPGA604 Socket Design Guidelines.
mPGA604 socket 15 times. The socket should meet the mPGA604 requirements
detailed in the mPGA604 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Intel® Xeon® Processor 7400 Series is 37.6 g (1.5oz). This
mass [weight] includes all the components that are included in the package.
mass [weight] includes all the components that are included in the package.
3.7
Processor Materials
lists some of the package components and associated materials.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N [80 lbf]
1,
2
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
Tensile
156 N [35 lbf]
3,
3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
Torque
8 N-m [70 lbf-in]
4,
4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber-Reinforced Resin
Substrate Pins
Gold Plated Copper