Intel 1.00 GHz BX80530F1000256 Data Sheet

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This section provides needed data for designing a thermal solution. However, for the correct 
thermal measuring processes, refer to AP-905, Intel

Guidelines (Order Number 245087). For the FC-PGA/FC-PGA2 using flip chip pin grid array 
packaging technology, Intel specifies the junction temperature (T

junction

). For the S.E.P. package 

and PPGA package, Intel specifies the case temperature (T

case

).

 provides both the Processor Power and Heatsink Design Target for Celeron processors. 

Processor Power is defined as the total power dissipated by the processor core and its package. 
Therefore, the S.E.P. Package’s Processor Power would also include power dissipated by the 
AGTL+ termination resistors. The overall system chassis thermal design must comprehend the 
entire Processor Power. The Heatsink Design Target consists of only the processor core, which 
dissipates the majority of the thermal power. 

Systems should design for the highest possible thermal power, even if a processor with a lower 
thermal dissipation is planned. The processor’s heatslug is the attach location for all thermal 
solutions. The maximum and minimum case temperatures are also specified in 

. A thermal 

solution should be designed to ensure the temperature of the case never exceeds these 
specifications. Refer to the Intel developer Web site at http://developer.intel.com for more 
information.