Intel 1.00 GHz BX80530F1000256 Data Sheet

Product codes
BX80530F1000256
Page of 128
Datasheet
95
 Intel
®
 Celeron
®
 Processor up to 1.10 GHz
NOTE:
Capacitors will be placed on the pin-side of the FC-PGA2 package in the area defined by G1, G2, and 
G3. This area is a keepout zone for motherboard designers.
For 
, the following apply:
1. It is not recommended to use any portion of the processor substrate as a mechanical reference 
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads.
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and 
processor interface.
3. See socket manufacturer’s force loading specification also to ensure compliance. Maximum static loading 
listed here does not account for the maximum reaction forces on the socket tabs or pins.
Table 53.  Package Dimensions (FC-PGA2 Package)
Symbol
Millimeters
Inches
Minimum
Maximum
Notes
Minimum
Maximum
Notes
A1
2.266
2.690
0.089
0.106
A2
0.980
1.180
0.038
0.047
B1
30.800
31.200
1.212
1.229
B2
30.800
31.200
1.212
1.229
C1
33.000 max
1.299 max
C2
33.000 max
1.299 max
D
49.428
49.632
1.946
1.954
D1
45.466
45.974
1.790
1.810
G1
0.000
17.780
0.000
0.700
G2
0.000
17.780
0.000
0.700
G3
0.000
0.889
0.000
0.035
H
2.540
Nominal
0.100
Nominal
L
3.048
3.302
0.120
0.130
Φ
P
0.431
0.483
0.017
0.019
Pin TP
0.508 Diametric True Position (Pin-to-Pin)
0.020 Diametric True Position (Pin-to-Pin)
Table 54.  Processor Case Loading Parameters (FC-PGA2 Package)
Parameter
Dynamic (max)
1
Static (max)
2,3
Unit
IHS Surface
200
100
lbf
IHS Edge
125
N/A
lbf
IHS Corner
75
N/A
ibf