Intel T5470 LF80537GG0252M Data Sheet

Product codes
LF80537GG0252M
Page of 113
Datasheet
109
Thermal Specifications and Design Considerations
NOTES:
1.
Intel does not support or recommend operation of the thermal diode under reverse bias. 
2.
Characterized across a temperature range of 50-105°C.
3.
Not 100% tested. Specified by design characterization.
4.
The ideality factor, nQ, represents the deviation from ideal transistor model behavior as 
exemplified by the equation for the collector current:
I
C
 = I
S
 * (e 
qV
BE
/n
Q
kT
 –1)
where I
S
 = saturation current, q = electronic charge, V
BE
 = voltage across the transistor 
base emitter junction (same nodes as VD), k = Boltzmann Constant, and T = absolute 
temperature (Kelvin).
5.1.2
Intel® Thermal Monitor
The Intel Thermal Monitor helps control the processor temperature by activating the 
TCC (Thermal Control Circuit) when the processor silicon reaches its maximum 
operating temperature. The temperature at which the Intel Thermal Monitor activates 
the TCC is not user configurable. Bus traffic is snooped in the normal manner and 
interrupt requests are latched (and serviced during the time that the clocks are on) 
while the TCC is active.
With a properly designed and characterized thermal solution, the TCC would only be 
activated for very short periods of time when running the most power-intensive 
applications. The processor performance impact due to these brief periods of TCC 
activation is expected to be minor and hence not detectable. An under-designed 
thermal solution that is not able to prevent excessive activation of the TCC in the 
anticipated ambient environment may cause a noticeable performance loss and may 
affect the long-term reliability of the processor. In addition, a thermal solution that is 
significantly under designed may not be capable of cooling the processor even when 
the TCC is active continuously.
The Intel Thermal Monitor controls the processor temperature by modulating (starting 
and stopping) the processor core clocks or by initiating an Enhanced Intel SpeedStep 
Technology transition when the processor silicon reaches its maximum operating 
temperature. The Intel Thermal Monitor uses two modes to activate the TCC: automatic 
mode and on-demand mode. If both modes are activated, automatic mode takes 
precedence. 
There are two automatic modes called Intel Thermal Monitor 1 (TM1) and Intel Thermal 
Monitor 2 (TM2). These modes are selected by writing values to the MSRs of the 
processor. After automatic mode is enabled, the TCC will activate only when the 
internal die temperature reaches the maximum allowed value for operation. 
When TM1 is enabled and a high temperature situation exists, the clocks will be 
modulated by alternately turning the clocks off and on at a 50% duty cycle. Cycle times 
are processor speed-dependent and will decrease linearly as processor core frequencies 
increase. Once the temperature has returned to a non-critical level, modulation ceases 
and TCC goes inactive. A small amount of hysteresis has been included to prevent rapid 
Table 28.
Thermal Diode Parameters Using Transistor Model
Symbol
Parameter
Min
Typ
Max
Unit
Notes
I
FW
Forward Bias Current
5
200
μA
1
I
E
Emitter Current
5
200
μA
1
n
Q
Transistor Ideality
0.997
1.001
1.008
2, 3, 4
Beta
0.1
0.4
0.5
2, 3
R
T
Series Resistance
3.0
4.5
7.0
Ω
2