Intel 4 1.60 GHz BX80528JK160G User Manual
Product codes
BX80528JK160G
Intel
®
Pentium
®
4 Processor in the 423-pin Package
43
4.0
Package Mechanical Specifications
The Intel
®
Pentium
®
4 Processor in the 423-pin Package uses Pin Grid Array (PGA) package
technology. Components of the package include an integrated heat spreader, processor silicon,
silicon mounting substrate or Organic Land Grid Array (OLGA), and an interposer which is the
pincarrier. Mechanical specifications for the processor are given in this section. See Section 1.1 for
a terminology listing. The processor socket which accepts the Pentium 4 processor in the 423-pin
package is referred to as a 423-Pin Socket. See the 423-Pin Socket (PGA423) Design Guidelines
for further details on the 423-Pin Socket.
silicon mounting substrate or Organic Land Grid Array (OLGA), and an interposer which is the
pincarrier. Mechanical specifications for the processor are given in this section. See Section 1.1 for
a terminology listing. The processor socket which accepts the Pentium 4 processor in the 423-pin
package is referred to as a 423-Pin Socket. See the 423-Pin Socket (PGA423) Design Guidelines
for further details on the 423-Pin Socket.
Note:
The drawing below is not to scale and is for reference only. The socket and system board are
supplied as a reference only.
supplied as a reference only.
Figure 16. Exploded View of Processor Components on a System Board
Capacitors
System board
Interposer
Socket
OLGA
Thermal Interface
Die
IHS