Intel III 1.13 GHz BX80530C1133256 User Manual

Product codes

BX80530C1133256

Datasheet

Pentium

III Processor for the PGA370 Socket at 500 MHz to 1.10 GHz

2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to

dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tjunction specification.

3. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to

Table 6 for voltage regulation and electrical specifications.

4. T

junctionoffset

is the worst-case difference between the thermal reading from the on-die thermal diode and the

hottest location on the processor’s core.

5. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the

die area over which the power is generated. Power for these processors is generated from the core area
shown in

Figure 21

6. T

JUNCTION

offset values do not include any thermal diode kit measurement error. Diode kit measurement

error must be added to the T

JUNCTION

offset value from the table, as outlined in the Intel

Pentium

III

processor Thermal Metrology for CPUID-068h Family Processors (Order Number: 245301). Intel has
characterized the use of the Analog Devices AD1021 diode measurement kit and found its measurement
error to be 1 °C.

7. This specification only applies to 1B GHz S-Spec #: SL4WM. This part has a VID request of 1.70 V, however

the processor should be supplied 1.76 V at the PGA Vcc pins by the VRM (Voltage Regulator Module) or by
the voltage regulator circuit.

8. This specification applies to processors with CPUID 068AH. 1B GHz exists in both FC-PGA and FC-PGA2

packages.

9. This specification applies to processors with CPUID 0686H.

10. Tjunction minimum specification is 0 °C.

Table 31

provides the thermal design power dissipation and maximum temperatures for the

Pentium

III

processor for the FC-PGA2 package. Systems should design for the highest possible

processor power, even if a processor with a lower thermal dissipation is planned. A thermal
solution should be designed to ensure the case temperature never exceeds these specifications.

NOTES:

1. These values are specified at nominal V

CORE

for the processor pins.

2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to

dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tcase specification.

3. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to

Table 7

for voltage regulation and electrical specifications.

4. T

CaseOffset

is the worst-case difference between the maximum case temperature and the thermal diode

temperature on the processor’s core. For more information please refer to the document, Intel

Pentium

III

Processor in the FC-PGA2 Package Thermal Design Guide.

5. This processor exists in both FC-PGA and FC-PGA2 packages.

4.2

Processor Die Area

Figure 21

is a block diagram of the Pentium

III

processor die layout and

Table 32

contains Pentium

III

processor die layout measurements. The layout differentiates the processor core from the cache

die area. In effect, the thermal design power identified in

Table 30

is dissipated entirely from the

processor core area. Thermal solution designs should compensate for this smaller heat flux area
and not assume that the power is uniformly distributed across the entire die area.

Table 31. Intel

Pentium

III Processor for the FC-PGA2 Package Thermal Design Power

Processor

Core

Frequency

(MHz)

System Bus

Frequency

(MHz)

Processor

Thermal Design

Power

2,3

CPUID 068Ah

(W)

Maximum

case

(°C)

Additional

Notes

866

133

29.5

933

133

31.5

1B GHz

1000

133

33.9

1.13 GHz

1133

133

37.5