Intel 4 620 JM80547PG0722MM Data Sheet

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The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package that 
interfaces with the motherboard via an LGA775 socket. The package consists of a processor core 
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package 
substrate and core and serves as the mating surface for processor component thermal solutions, 
such as a heatsink. 

 shows a sketch of the processor package components and how they 

are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details 
on the LGA775 socket.

The package components shown in 

 include the following:

1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors

1. Socket and motherboard are included for reference and are not part of processor package.

The package mechanical drawings are shown in 

 through 

include dimensions necessary to design a thermal solution for the processor. These dimensions 
include:

1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in]. 

Guidelines on potential IHS flatness variation with socket load plate actuation and installation of 
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.

System Board

LGA775 Socket

Capacitors

TIM

Core (die)

IHS

Substrate