Intel 4 620 JM80547PG0722MM Data Sheet

75

The Pentium 4 processor requires a thermal solution to maintain temperatures within operating 
limits as set forth in 

. Any attempt to operate the processor outside these operating 

limits may result in permanent damage to the processor and potentially other components within 
the system. As processor technology changes, thermal management becomes increasingly crucial 
when building computer systems. Maintaining the proper thermal environment is key to reliable, 
long-term system operation.

A complete thermal solution includes both component and system level thermal management 
features. Component level thermal solutions can include active or passive heatsinks attached to the 
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of 
system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Intel

Guidelines.

The boxed processor will ship with a component thermal solution. Refer to 

the boxed processor.

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the 
system/processor thermal solution should be designed such that the processor remains within the 
minimum and maximum case temperature (T

C

) specifications when operating at or below the 

Thermal Design Power (TDP) value listed per frequency in 

. Thermal solutions not 

designed to provide this level of thermal capability may affect the long-term reliability of the 
processor and system. For more details on thermal solution design, refer to the appropriate 
processor thermal design guidelines. 

The Pentium 4 processor introduces a new methodology for managing processor temperatures that 
is intended to support acoustic noise reduction through fan speed control. Selection of the 
appropriate fan speed is based on the temperature reported by the processor’s Thermal Diode. If the 
diode temperature is greater than or equal to T

CONTROL

, then the processor case temperature must 

remain at or below the temperature as specified by the thermal profile. If the diode temperature is 
less than T

CONTROL

, then the case temperature is permitted to exceed the thermal profile, but the 

diode temperature must remain at or below T

CONTROL

. Systems that implement fan speed control 

must be designed to take these conditions into account. Systems that do not alter the fan speed only 
need to guarantee the case temperature meets the thermal profile specifications.

To determine a processor's case temperature specification based on the thermal profile, it is 
necessary to accurately measure processor power dissipation.