Intel 4 620 JM80547PG0722MM Data Sheet

91

The Pentium 4 processor will also be offered as a boxed processor. Boxed processors are intended 
for system integrators who build systems from baseboards and standard components. The boxed 
Pentium 4 processor will be supplied with a cooling solution. This chapter documents baseboard 
and system requirements for the cooling solution that will be supplied with the boxed Pentium 4 
processor. This chapter is particularly important for OEMs that manufacture baseboards for system 
integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and 
inches [in brackets]. 

 shows a mechanical representation of a boxed Pentium 4 processor.

Drawings in this section reflect only the specifications on the boxed processor product. These 
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system 
designers’ responsibility to consider their proprietary cooling solution when designing to the 
required keep-out zone on their system platforms and chassis. Refer to the Intel

Processor on 90 nm Process on 90 nm Process in the 775-land LGA Package Thermal Design 
Guidelines for further guidance. 

 

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.