Intel 1.40 GHz RH80532NC017256 Data Sheet

298517-006 Datasheet 

65 

The Mobile Intel Celeron Processor is packaged in a 478-pin Micro-FCPGA package.  The Low Voltage 
and Ultra Low Voltage processors will not be available in this package. The mechanical specifications 
for the socketable package are provided in Table 43. Figure 25 through Figure 27 illustrate different 
views of the package. 

A 

Overall height, top of die to package seating plane 

1.81 

2.03 

mm 

- 

Overall height, top of die to PCB surface, including socket(1) 

4.69 

5.15 

mm 

A1 Pin 

length 

1.95 

2.11 

mm 

A2 Die 

height 

0.854 mm 

B Pin 

diameter 

0.28 

0.36 

mm 

D 

Package substrate length 

34.9 

35.1 

mm 

E Package 

substrate 

width 

34.9 

35.1 

mm 

D1 Die 

length 

11.18

3

 

10.82

4

 

mm 

E1 Die 

width 

7.20

3

 

6.85

4

 

mm 

e Pin 

pitch 

1.27 

mm 

K 

Package edge keep-out 

5 

mm 

K1 Package 

corner 

keep-out 

7  mm 

K3 

Pin-side capacitor boundary 

14 

mm 

- 

Pin tip radial true position 

<=0.254 

mm 

N Pin 

count 

478 

each 

Pdie 

Allowable pressure on the die for thermal solution 

- 

689 

kPa 

W Package 

weight 

4.5 

 

g 

 

Package surface Flatness 

0.286 

mm 

 

1.  All dimensions are subject to change. 
2.  Overall height with socket is based on design dimensions of the Micro-FCPGA package and socket with no 

thermal solution attached.  Values were based on design specifications and tolerances.  This dimension is 
subject to change based on socket design, OEM motherboard design, or OEM SMT process. 

3.  Dimension for CPUID = 0x06B1. 
4.  Dimension for CPUID = 0x06B4.