Intel 1.40 GHz RH80532NC017256 Data Sheet

80 Datasheet

 

298517-006 

In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat pipe, or 
other heat transfer system) must make firm contact to the exposed processor die. The processor die must 
be clean before the thermal solution is attached or the processor may be damaged.     

Table 48 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum T

J

 

temperatures for the Mobile Intel Celeron Processor.  The thermal solution should be designed to ensure 
the junction temperature never exceeds the specified value while operating at the Thermal Design 
Power. Additionally, a secondary failsafe mechanism in hardware should be provided to shutdown the 
processor at 101

°

C to prevent permanent damage, as described in Section 3.1.3.  TDP is a thermal 

design power specification based on the worst case power dissipation of the processor while executing 
publicly available software under normal operating conditions at nominal voltages.  Contact your Intel 
Field Sales Representative for further information.