Intel 1.70 GHz RH80532NC029256 Data Sheet
Product codes
RH80532NC029256
Mobile Intel
®
Celeron
®
Processor (0.13 µ)
Micro-FCBGA and Micro-FCPGA Packages Datasheet
298517-006 Datasheet
69
5.2
Surface Mount Micro-FCBGA Package
The Mobile Intel Celeron Processor will also be available in a surface mount, 479-ball Micro-FCBGA
package. The Low Voltage and Ultra Low Voltage processors will be available only in this package.
The Mobile Intel Celeron processors at 1.45V and 1.5V will not be available in this package.
Mechanical specifications are shown in Table 44. Figure 28 through Figure 30 illustrate different views
of the package.
package. The Low Voltage and Ultra Low Voltage processors will be available only in this package.
The Mobile Intel Celeron processors at 1.45V and 1.5V will not be available in this package.
Mechanical specifications are shown in Table 44. Figure 28 through Figure 30 illustrate different views
of the package.
The Micro-FCBGA package may have capacitors placed in the area surrounding the die. Because the
die-side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may short
the capacitors, and possibly damage the device or render it inactive. The use of an insulating material
between the capacitors and any thermal solution should be considered to prevent capacitor shorting.
die-side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may short
the capacitors, and possibly damage the device or render it inactive. The use of an insulating material
between the capacitors and any thermal solution should be considered to prevent capacitor shorting.
Table 44. Micro-FCBGA Package Mechanical Specifications
Symbol Parameter Min
Max
Unit
A
Overall height, as delivered (1)
2.27
2.77
mm
A2 Die
height
0.854 mm
b Ball
diameter
0.78 mm
D
Package substrate length
34.9
35.1
mm
E Package
substrate
width
34.9
35.1
mm
D1 Die
length
11.18
3
10.82
4
mm
E1 Die
width
7.20
3
6.85
4
mm
e Ball
pitch
1.27 mm
N Ball
count
479 each
K
Keep-out outline from edge of package
5
mm
K1
Keep-out outline at corner of package
7
mm
K2
Capacitor keep-out height
-
0.7
mm
S
Package edge to first ball center
1.625
mm
--
Solder ball coplanarity
0.2
mm
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W Package
weight
4.5
g
NOTES:
1. All dimensions are subject to change.
2. Overall height as delivered. Values were based on design specifications and tolerances. Final height after
2. Overall height as delivered. Values were based on design specifications and tolerances. Final height after
surface mount depends on OEM motherboard design and SMT process.
3. Dimension for CPUID = 0x06B1.
4. Dimension for CPUID = 0x06B4.
4. Dimension for CPUID = 0x06B4.