Intel 4 2.00 GHz BX80532PC2000B User Manual

Product codes

BX80532PC2000B

Intel

Pentium

4 Processor on 0.13 Micron Process Datasheet

Figures

2-1

VID Pin Voltage and Current Requirements .................................................17

2-2

Typical VCCIOPLL, VCCA and VSSA Power Distribution ..................................19

2-3

Phase Lock Loop (PLL) Filter Requirements ......................................................19

2-4

Static and Transient Tolerance (For Intel

Pentium

Processor With 512-KB L2 Cache on 0.13 Micron Process)...............................29

2-5

Static and Transient Tolerance (For Intel

Pentium

Processor Extreme Edition Supporting Hyper-Threading Technology)...............31

2-6

ITPCLKOUT[1:0] Output Buffer Diagram ............................................................34

2-7

Test Circuit ..........................................................................................................35

3-1

Exploded View of Processor Components on a System Board ..........................37

3-2

Processor Package .............................................................................................38

3-3

Processor Cross-Section and Keep-In ................................................................39

3-4

Processor Pin Detail............................................................................................39

3-5

IHS Flatness Specification ..................................................................................40

3-6

Processor Markings (Processors with Fixed VID) ...............................................42

3-7

Processor Markings (Processors with Multiple VID) ...........................................42

3-8

The Coordinates of the Processor Pins As Viewed from the Top

of the Package ....................................................................................................43

5-1

Example Thermal Solution (Not to Scale) ...........................................................67

5-2

Guideline Locations for Case Temperature (TC) Thermocouple Placement ......70

6-1

Stop Clock State Machine ...................................................................................72

7-1

Mechanical Representation of the Boxed Processor ..........................................77

7-2

Side View Space Requirements for the Boxed Processor ..................................78

7-3

Top View Space Requirements for the Boxed Processor ...................................79

7-4

Boxed Processor Fan Heatsink Power Cable Connector Description.................80

7-5

MotherBoard Power Header Placement Relative to Processor Socket ..............81

7-6

Boxed Processor Fan Heatsink Airspace Keep-Out Requirements

(Side 1 View) .......................................................................................................82

7-7

Boxed Processor Fan Heatsink Airspace Keep-Out Requirements

(Side 2 View) .......................................................................................................83

7-8

Boxed Processor Fan Heatsink Set Points .........................................................83