Intel ULV 353 LE80536VC900512 Data Sheet

Product codes
LE80536VC900512
Page of 80
 
 Mobile Intel
®
 Celeron
®
 Processor (0.18µ) in BGA2 and Micro-PGA2 Packages  
283654-003 Datasheet 
 
 
21 
These input buffers have no internal pull-up or pull-down resistors and system logic can use 
CMOS or Open-drain drivers to drive them. 
The Open-drain output signals have open drain drivers and external pull-up resistors are required. 
One of the two output signals (IERR#) is a catastrophic error indicator and is tri-stated (and 
pulled-up) when the processor is functioning normally. The FERR# output can be either tri-stated 
or driven to V
SS
 when the processor is in a low-power state depending on the condition of the 
floating point unit. Since this signal is a DC current path when it is driven to V
SS
, Intel 
recommends that the software clears or masks any floating-point error condition before putting the 
processor into the Deep Sleep state. 
3.1.5.3 Other 
Signals 
The system bus clock (BCLK) must be driven in all of the low-power states except the Deep Sleep 
state. The APIC clock (PICCLK) must be driven whenever BCLK is driven unless the APIC is 
hardware disabled or the processor is in the Sleep state. Otherwise, it is permitted to turn off 
PICCLK by holding it at V
SS
. The system bus clock should be held at V
SS
 when it is stopped in the 
Deep Sleep state. 
In the Auto Halt and Stop Grant states the APIC bus data signals (PICD[1:0]) may toggle due to 
APIC bus messages. These signals are required to be tri-stated and pulled-up when the processor 
is in the Quick Start, Sleep, or Deep Sleep states unless the APIC is hardware disabled.  
3.2 
Power Supply Requirements 
3.2.1 Decoupling 
Recommendations 
The amount of bulk decoupling required on the V
CC
 and V
CCT
 planes to meet the voltage tolerance 
requirements for the mobile Intel Celeron processor are a strong function of the power supply 
design. Contact your Intel Field Sales Representative for tools to help determine how much bulk 
decoupling is required. The processor core power plan (V
CC
) should have eight 0.1-
µ
F high 
frequency decoupling capacitors placed underneath the die and twenty 0.1-
µ
F mid frequency 
decoupling capacitors placed around the die as close to the die as flex solution allows. The system 
bus buffer power plane (V
CCT
) should have twenty 0.1-
µ
F high frequency decoupling capacitors 
around the die.   
3.2.2 Voltage 
Planes 
All V
CC
 and V
SS 
pins/balls must be connected to the appropriate voltage plane. All V
CCT
 and V
REF
 
pins/balls must be connected to the appropriate traces on the system electronics. In addition to the 
main V
CC
, V
CCT
, and V
SS
 power supply signals, PLL1 and PLL2 provide analog decoupling to the 
PLL section. PLL1 and PLL2 should be connected according to Figure 4. Do not connect PLL2 
directly to V
SS
. Appendix A contains the RLC filter specification.