Intel III Xeon 550 MHz 80525KY550512 User Manual

Product codes
80525KY550512
Page of 112
Pentium
® 
III Xeon™ Processor at 500 and 550 MHz
 Datasheet
51
NOTES
1. These values are specified at nominal V
CCCORE
 for the processor core and nominal V
CCL2
 for the L2 cache.
2. Processor power indicates the worst case power that can be dissipated by the entire processor. This value 
will be determined after the product has been characterized. It is not possible for the AGTL+ bus, the L2 
cache and the processor core to all be at full power simultaneously.
3. The combined power that dissipates through the thermal plate is the thermal plate power. This value will be 
determined after the product has been characterized. The value shown follows the expectation that virtually 
all of the power will dissipate through the thermal plate.
4. AGTL+ power is the worst case power dissipated in the termination resistors for the AGTL+ bus.
5. “FMB” is a suggested design guideline for a flexible baseboard design. Notice that worst case L2 power and 
worst case processor power do not occur on the same processor.
5.1.2
Plate Flatness Specification
The thermal plate flatness for the Pentium 
III
 Xeon processor is specified to 0.010" across the entire 
thermal plate surface, with no more than a 0.003" step anywhere on the surface of the plate, as 
shown in 
Table 38.  Thermal Design Power 
1
Processor 
Core 
Frequency
(MHz)
L2 
Cache 
Size
Core 
Power
(W)
L2 
Power
(W)
AGTL+ 
Power
4
(W)
Processor 
Power
2
(W)
Thermal 
Plate 
Power
3
(W)
Min 
T
PLATE
(°C)
Max 
T
PLATE
(°C)
Min 
T
COVER
(°C)
Max 
T
COVER
(°C)
FMB
5
-
35.2
21.0
2
50.0
50.0
0
68
0
75
500
512K
28.0
12.0
2
36.0
37.0
0
75
0
75
500
1M
28.0
19.0
2
44.0
45.0
0
75
0
75
500
2M
28.0
11.6
2
36.2
37.1
0
75
0
75
550
512K
30.8
7.0
2
34.0
35.0
0
68
0
75
550
1M
30.8
7.0
2
34.0
35.0
0
68
0
75
550
2M
30.8
12.4
2
39.5
40.5
0
68
0
75
Figure 19. Plate Flatness Reference
.003/1.00x1.00