Intel 4 HT 631 80552PG0802M2M Data Sheet

Product codes
80552PG0802M2M
Page of 106
Datasheet
99
 
Balanced Technology Extended (BTX) Boxed Processor Specifications
Document, Balanced Technology Extended (BTX) System Design Guide, and the 
appropriate processor Thermal and Mechanical Design Guidelines (see 
) for 
more detailed information regarding the support and retention module and chassis 
interface and keepout zones. 
 illustrates the assembly stack including the 
SRM.
8.2
Electrical Requirements
8.2.1
Thermal Module Assembly Power Supply
The boxed processor's Thermal Module Assembly (TMA) requires a +12 V power 
supply. The TMA will include power cable to power the integrated fan and will plug into 
the 4-wire fan header on the baseboard. The power cable connector and pinout are 
. Baseboards must provide a compatible power header to support 
the boxed processor. 
 contains specifications for the input and output signals at 
the TMA. 
The TMA outputs a SENSE signal, which is an open- collector output that pulses at a 
rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides V
OH
 to match 
the system board-mounted fan speed monitor requirements, if applicable. Use of the 
SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should 
be tied to GND.
The TMA receives a Pulse Width Modulation (PWM) signal from the motherboard from 
the 4
th
 pin of the connector labeled as CONTROL.
Figure 29.
Assembly Stack Including the Support and Retention Module
Thermal Module Assembly
• Heatsink  &  Fan
• Clip
• Structural  Duct
Motherboard
SRM
Chassis Pan