Intel ULV 383 LE80536VC0011M Data Sheet
Product codes
LE80536VC0011M
Mobile Intel
®
Celeron
®
Processor (0.18µ) in BGA2 and Micro-PGA2 Packages
283654-003 Datasheet
49
Table 28. Socketable Micro-PGA2 Package Specification
Symbol Parameter
Min
Max
Unit
A
Overall Height, top of die to seating plane of interposer
3.13
3.73
mm
A
1
Pin
Length
1.25
REF
mm
A
2
Die Height
0.854 REF
mm
B Pin
Diameter
0.30
REF
mm
D
2
Package Width
28.27 REF
mm
D
Die Substrate Width
27.05
27.35
mm
D
1
Die
Width
D0 Step 8.82 REF (CPUID = 068Ah)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
C0 Step 8.82 REF (CPUID = 0686h)
B0 Step 9.28 REF (CPUID = 0683h)
A2 Step 9.37 REF (CPUID = 0681h)
mm
E
2
Package Length
34.21 REF
mm
E
Die Substrate Length
30.85
31.15
mm
E
1
Die
Length
D0 Step 11.00 REF (CPUID = 068Ah)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
C0 Step 10.80 REF (CPUID = 0686h)
B0 Step 11.23 REF (CPUID = 0683h)
A2 Step 11.27 REF (CPUID = 0681h)
mm
e Pin
Pitch
1.27
mm
—
Pin Tip Radial True Position
≤
0.127 REF
mm
N Pin
Count
495
each
S
1
Outer Pin Center to Short Edge of Substrate
2.144 REF
mm
S
2
Outer Pin Center to Long Edge of Substrate
1.206 REF
mm
P
DIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W Package
Weight
6.2
REF
grams