Intel D2500 DF8064101055400 Data Sheet

Datasheet - Volume 1 of 2

115

The processor requires a thermal solution to maintain temperatures within operating 

limits as set forth in Section Thermal Specifications. Any attempt to operate the 

processor outside these operating limits may result in permanent damage to the 

processor and potentially other components in the system. As processor technology 

changes, thermal management becomes increasingly crucial when building computer 

systems. Maintaining the proper thermal environment is key to reliable, long-term 

system operation. 

A complete thermal solution includes both component and system level thermal 

management features. Component level thermal solutions include active or passive 

heatsink attached to the exposed processor die. The solution should make firm contact 

to the die while maintaining processor mechanical specifications such as pressure. A 

typical system level thermal solution may consist of a system fan used to evacuate or 

pull air through the system. For more information on designing a component level 

thermal solution. Alternatively, the processor may be in a fan-less system, but would 

likely still use a multi-component heat spreader. Note that trading of thermal solutions 

also involves trading performance. 

To allow for the optimal operation and long-term reliability of Intel processor-based 

systems, the system/processor thermal solution should be designed such that the 

processor remains within the minimum and maximum junction temperature (Tj) 

specifications at the corresponding thermal design power (TDP) value listed in

. Thermal solutions not designed to provide this level of thermal capability 

may affect the long-term reliability of the processor and system. For more details on 

thermal solution design. 

The case temperature is defined at the geometric top center of the processor. Analysis 

indicates that real applications are unlikely to cause the processor to consume the 

theoretical maximum power dissipation for sustained time periods. Intel recommends 

that complete thermal solution designs target the TDP indicated in 

 instead 

of the maximum processor power consumption. The Intel Thermal Monitor feature is 

designed to help protect the processor in the unlikely event that an application exceeds 

the TDP recommendation for a sustained period of time. For more details on the usage 

of this feature, refer to Section 

. In all cases the Intel Thermal Monitor 

feature must be enabled for the processor to remain within specification.