Intel 887 AV8062701085401 Data Sheet

P

PACKAGE(C6)

Package power in Package C6 state

—

—

0.6

W

1, 2

P

PACKAGE(C7)

Package power in Package C7 state

—

—

0.4

W

1, 2

P

PACKAGE(C9)

Package power in Package C9 state

—

—

0.03

W

1, 2

P

PACKAGE(C10)

Package power in Package C10 state

—

—

0.03

W

1, 2

Notes: 1. Package power includes both components in the processor package: processor and PCH.

2. The power specification based on pre-silicon estimations, and may be subject to change.
3. Measured at Tj = 35 °C.
4. The idle power specifications are not 100% tested. These power specifications are determined by the

characterization at higher temperatures and extrapolating the values for the junction temperature indicated.

Occasionally the processor may operate in conditions that are near to its maximum

operating temperature. This can be due to internal overheating or overheating within

the platform. To protect the processor and the platform from thermal failure, several

thermal management features exist to reduce package power consumption and

thereby temperature in order to remain within normal operating limits. Furthermore,

the processor supports several methods to reduce memory power.

The purpose of the Adaptive Thermal Monitor is to reduce processor core power

consumption and temperature until it operates at or below its maximum operating

temperature. Processor core power reduction is achieved by:
•

Adjusting the operating frequency (using the core ratio multiplier) and voltage.

•

Modulating (starting and stopping) the internal processor core clocks (duty cycle).

The Adaptive Thermal Monitor can be activated when the package temperature,

monitored by any digital thermal sensor (DTS) meets or exceeds its maximum

operating temperature. The maximum operating temperature implies either maximum

junction temperature Tj

MAX

, or Tj

MAX

 minus TCC Activation offset.

Exceeding the maximum operating temperature activates the thermal control circuit

(TCC), if enabled. When activated, the thermal control circuit (TCC) causes both the

processor core and graphics core to reduce frequency and voltage adaptively. The

Adaptive Thermal Monitor will remain active as long as the package temperature

exceeds its specified limit. Therefore, the Adaptive Thermal Monitor will continue to

reduce the package frequency and voltage until the TCC is de-activated.

Tj

MAX

 is factory calibrated and is not user configurable. The default value is software

visible in the TEMPERATURE_TARGET (0x1A2) MSR, bits [23:16]. The

TEMPERATURE_TARGET value stays the same when TCC Activation offset is enabled.

The Adaptive Thermal Monitor does not require any additional hardware, software

drivers, or interrupt handling routines. It is not intended as a mechanism to maintain

processor TDP. The system design should provide a thermal solution that can maintain

TDP within its intended usage range.

Adaptive Thermal Monitor protection is always enabled.

5th Generation Intel

®

 Core

™

 Processor Family, Intel

®

 Core

™

 M Processor Family, Mobile Intel

®

 Pentium

®

 Processor Family, and

Mobile Intel

®

 Celeron

®

 Processor Family

Datasheet – Volume 1 of 2

March 2015

66

Order No.: 330834-004v1