Intel i5-2435M AV8062700995706 Data Sheet

The thermal solution provides both component-level and system-level thermal

management. To allow for the optimal operation and long-term reliability of Intel

processor-based systems, the system/processor thermal solution should be designed

so that the processor:
•

Remains below the maximum junction temperature (Tj

Max

) specification at the

maximum thermal design power (TDP).

•

Conforms to system constraints, such as system acoustics, system skin-

temperatures, and exhaust-temperature requirements.

Caution: Thermal specifications given in this chapter are on the component and

package level and apply specifically to the processor. Operating the processor outside

the specified limits may result in permanent damage to the processor and potentially

other components in the system.

The processor TDP is the maximum sustained power that should be used for design of

the processor thermal solution. TDP is a power dissipation and junction temperature

operating condition limit specified in this document; that is validated during

manufacturing for the base configuration when executing a near worst case

commercially available workload as specified by Intel for the SKU segment. TDP may

be exceeded for short periods of time or if running a "power virus" workload.

The processor integrates multiple processing and graphics cores and PCH on a single

package.This may result in differences in the power distribution across the die and

must be considered when designing the thermal solution.

Intel

®

 Turbo Boost Technology 2.0 allows processor cores and processor graphics

cores to run faster than the guaranteed frequency. It is invoked opportunistically and

automatically as long as the processor is conforming to its temperature, power

delivery, and current specification limits. When Intel Turbo Boost Technology 2.0 is

enabled:
•

Applications are expected to run closer to TDP more often as the processor will

attempt to maximize performance by taking advantage of available TDP headroom

in the processor package.

•

The processor may exceed the TDP for short durations to use any available

thermal capacitance within the thermal solution. The duration and time of such

operation can be limited by platform runtime configurable registers within the

processor.

•

Thermal solutions and platform cooling that are designed to less than thermal

design guidance may experience thermal and performance issues since more

applications will tend to run at or near TDP for significant periods of time.

Intel Turbo Boost Technology 2.0 availability may vary between the different SKUs.

5th Generation Intel

®

 Core

™

 Processor Family, Intel

®

 Core

™

 M Processor Family, Mobile Intel

®

 Pentium

®

 Processor Family, and

Mobile Intel

®

 Celeron

®

 Processor Family

Datasheet – Volume 1 of 2

March 2015

60

Order No.: 330834-004v1