Intel i5-3380M AV8063801110100 User Manual

Product codes
AV8063801110100
Page of 112
Electrical Specifications 
88
Datasheet, Volume 1
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
V
IL
 is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low 
value.
3.
V
IH
 is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high 
value.
4.
V
IH
 and V
OH
 may experience excursions above V
DDQ
. However, input signal drivers must comply with the 
signal quality specifications.
5.
This is the pull-up/pull-down driver resistance. 
6.
R
TERM
 is the termination on the DIMM and in not controlled by the processor.
7.
The minimum and maximum values for these signals are programmable by BIOS to one of the two sets. 
8.
SM_DRAMPWROK must have a maximum of 15 ns rise or fall time over V
DDQ 
* 0.55 ±200 mV and the edge 
must be monotonic.
9.
SM_VREF is defined as V
DDQ
/2
10. R
on
 tolerance is preliminary and might be subject to change.
R
ON_UP(CK)
DDR3 Clock Buffer pull-
up Resistance
20
26
40
5, 10
R
ON_DN(CK)
DDR3 Clock Buffer pull-
down Resistance
20
26
40
5, 10
R
ON_UP(CMD)
DDR3 Command Buffer 
pull-up Resistance
15
20
25
5, 10
R
ON_DN(CMD)
DDR3 Command Buffer 
pull-down Resistance
15
20
25
5, 10
R
ON_UP(CTL)
DDR3 Control Buffer 
pull-up Resistance
15
20
25
5, 10
R
ON_DN(CTL)
DDR3 Control Buffer 
pull-down Resistance
15
20
25
5, 10
I
LI
Input Leakage Current 
(DQ, CK)
0V
0.2*V
DDQ
0.8*V
DDQ
V
DDQ
± 0.75
± 0.55
± 0.9
± 1.4 
mA
I
LI
Input Leakage Current 
(CMD, CTL)
0V
0.2*V
DDQ
0.8*V
DDQ
V
DDQ
± 0.85
± 0.65
± 1.10
± 1.65
mA
Table 7-7.
DDR3 Signal Group DC Specifications (Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Units
Notes
1,7