Intel 9560 CM8063101049716 Data Sheet

129

The processor may contain components on the substrate that define component 
keepout zone requirements. A thermal and mechanical solution design must not intrude 
into the required keepout zones. Decoupling capacitors are typically mounted to both 
the top-side and bottom-side of the package substrate. See 

for Intel

®

 

Itanium

®

 9300 Series Processor keepout zones and 

 for Intel

®

 Itanium

®

 

9500 Series Processor keepout zones.

 provides dynamic and static load specifications for the processor package. 

These mechanical load limits should not be exceeded during heatsink assembly, 
shipping conditions, or standard use condition. Also, any mechanical system or 
component testing should not exceed the maximum limits. The processor package 
substrate should not be used as a mechanical reference or load-bearing surface for 
thermal and mechanical solutions.

 includes a list of guidelines on package handling in terms of recommended 

maximum loading on the processor IHS relative to a fixed substrate. These package 
handling loads may be experienced during heatsink removal.

1.

A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2.

A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.

3.

A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top 

surface.

4.

These guidelines are based on limited testing for design characterization.

The Intel

®

 Itanium

®

 Processor 9300 Series can be inserted into and removed from a 

LGA1248 socket and engaged and disengaged with the Ararat voltage regulator up to a 
maximum limit as specified in 

.

Static Compressive Load

1000

N

1, 2, 3

1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2. This is the allowable static force that can be applied by the heatsink and retention solution to maintain the

heatsink and processor interface.

3. These parameters are based on limited testing for design characterization. Loading limits are for the package

only and do not include the limits of the processor socket.

Dynamic Compressive Load
t < 30 ms

1793

N

Transient
t < 1 s

1090

N

Shear

356

N

1, 4

Tensile

156

N

2, 4

Torque

8

N-m

3, 4