Intel Core 2 Duo E8230 BX80570E8230 Data Sheet

Product codes
BX80570E8230
Page of 102
Boxed Processor Specifications
94
Datasheet
7.2
Mechanical Specifications
7.2.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The 
boxed processor will be shipped with an unattached fan heatsink. 
 shows a 
mechanical representation of the boxed processor. 
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper 
cooling. The physical space requirements and dimensions for the boxed processor with 
assembled fan heatsink are shown in 
 (Side View), and 
 (Top View). 
The airspace requirements for the boxed processor fan heatsink must also be 
incorporated into new baseboard and system designs. Airspace requirements are 
shown in 
. Note that some figures have centerlines shown 
(marked with alphabetic designations) to clarify relative dimensioning. 
NOTES:
1.
Diagram does not show the attached hardware for the clip design and is provided only as a 
mechanical representation.
Figure 21.
Space Requirements for the Boxed Processor (Side View)
Figure 22.
Space Requirements for the Boxed Processor (Top View)
B
d P
Sid Vi
95.0
[3.74] 
10.0
[0.39] 
25.0
[0.98] 
81.3 
[3.2]
95.0 
[3.74]
95.0 
[3.74]