Intel i5-4300Y CL8064701558601 Data Sheet
Product codes
CL8064701558601
8.0
Package Specifications
Package Mechanical Attributes
The U-Processor Line and Y-Processor Line use a Flip Chip technology and Multi-Chip
package (MCP) available in a Ball Grid Array (BGA) package. The following table
provides an overview of the mechanical attributes of this package.
Table 55.
Package Mechanical Attributes
Parameter
U-Processor Line and Y-Processor Line
Package
Technology
Package Type
Flip Chip Ball Grid Array
Interconnect
Ball Grid Array (BGA)
Lead Free
Yes
Halogenated Flame Retardant Free
Yes
Package
Configuration
Solder Ball Composition
SAC 405
Ball/Pin Count
1168
Grid Array Pattern
Balls Anywhere
Land Side Capacitors
Yes
Die Side Capacitors
No
Die Configuration
Multi-Chip Package (MCP) / 2 dies
Package
Dimensions
Nominal Package Size
40.0 mm x 24.0 mm
Min Ball/Pin pitch
0.65 mm
Package Loading Specifications
Table 56.
Package Loading Specifications
Maximum Static Normal Load
Limit
Notes
Y-Processor Line
22 N (15 lbf)
1, 2, 3
U-Processor Line/ Y-Processor Line
BGA
67 N (15 lbf)
1, 2, 3
Notes: 1. The thermal solution attach mechanism must not induce continuous stress to the package. It
may only apply a uniform load to the die to maintain a thermal interface.
2. This specification applies to the uniform compressive load in the direction perpendicular to the
dies’ top surface.
3. This specification is based on limited testing for design characterization.
8.1
8.2
Processors—Package Specifications
Mobile 4th Generation Intel
®
Core
™
Processor Family, Mobile Intel
®
Pentium
®
Processor Family, and Mobile Intel
®
Celeron
®
Processor Family
Datasheet – Volume 1 of 2
July 2014
98
Order No.: 329001-007