Intel Core 2 Quad Q8200 BX80570Q8200 User Manual

12

Datasheet

The processor uses some of the infrastructure already enabled by 775_VR_CONFIG_05 

platforms including heatsink, heatsink retention mechanism, and socket. 

Manufacturability is a high priority; hence, mechanical assembly may be completed 

from the top of the baseboard and should not require any special tooling.

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in 

the active state when driven to a low level. For example, when RESET# is low, a reset 

has been requested. Conversely, when NMI is high, a nonmaskable interrupt has 

occurred. In the case of signals where the name does not imply an active state but 

describes part of a binary sequence (such as address or data), the ‘#’ symbol implies 

that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and 

D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

“Front Side Bus” refers to the interface between the processor and system core logic 

(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, 

memory, and I/O.

Commonly used terms are explained here for clarification:

• Intel

 Core™2 Extreme processor QX9000 series — Quad core Extreme 

Edition processor in the FC-LGA6 package with two 6 MB L2 cache. 

• Intel

 Core™2 Quad processor Q9000 series — Quad core processor in the FC-

LGA8 package with two 6 MB L2 caches or two 3 MB L2 caches. 

• Intel

 Core™2 Quad processor Q8000 Series — Quad core processor in the 

FC-LGA8 package with two 4 MB L2 caches or two 2 MB L2 caches..

• Intel

 Core™2 Quad processor Q9000S series — Low power Quad core 

processor in the FC-LGA8 package with two 6 MB L2 caches or two 3 MB L2 caches. 

• Intel

 Core™2 Quad Processor Q8000S Series — Low power Quad core 

processor in the FC-LGA8 package with two 4 MB L2 caches or two 2 MB L2 caches 

caches.

• Processor — For this document, the term processor is the generic form of the 

Intel

®

 Core™2 Extreme processor QX9000 series, the Intel

®

 Core™2 Quad 

processor Q9000, Q9000S, Q8000, and Q8000S series.

• Enhanced Intel

 microarchitecture — A new foundation for Intel

®

 

architecture-based desktop, mobile and mainstream server multi-core processors. 

For additional information refer to: 

http://www.intel.com/technology/architecture/

coremicro/

• Keep-out zone — The area on or near the processor that system design can not 

utilize. 

• Processor core — Processor die with integrated L2 cache. 
• LGA775 socket — The processor mates with the system board through a surface 

mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 

interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any 

mechanical features for heatsink attach, a retention mechanism is required. 

Component thermal solutions should attach to the processor via a retention 

mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to 

the chipset. Also referred to as the processor system bus or the system bus. All