Intel Core 2 Quad Q8200 BX80570Q8200 User Manual

Product codes
BX80570Q8200
Page of 104
Datasheet
39
Package Mechanical Specifications
3.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into 
the required keep-out zones. Decoupling capacitors are typically mounted to either the 
topside or land-side of the package substrate. See 
 an
 for keep-
out zones. The location and quantity of package capacitors may change due to 
manufacturing efficiencies but will remain within the component keep-in.
3.3
Package Loading Specifications
 provides dynamic and static load specifications for the processor package. 
These mechanical maximum load limits should not be exceeded during heatsink 
assembly, shipping conditions, or standard use condition. Also, any mechanical system 
or component testing should not exceed the maximum limits. The processor package 
substrate should not be used as a mechanical reference or load-bearing surface for 
thermal and mechanical solution. The minimum loading specification must be 
maintained by any thermal and mechanical solutions.
.
NOTES:
1.
These specifications apply to uniform compressive loading in a direction normal to the 
processor IHS.
2.
This is the maximum force that can be applied by a heatsink retention clip. The clip must 
also provide the minimum specified load on the processor package.
3.
These specifications are based on limited testing for design characterization. Loading limits 
are for the package only and do not include the limits of the processor socket. 
4.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static 
load requirement.
3.4
Package Handling Guidelines
 includes a list of guidelines on package handling in terms of recommended 
maximum loading on the processor IHS relative to a fixed substrate. These package 
handling loads may be experienced during heatsink removal.
NOTES:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top 
surface. 
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the 
IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal 
to the IHS top surface.
4.
These guidelines are based on limited testing for design characterization. 
Table 3-1.
Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static
80 N [17 lbf]
311 N [70 lbf]
1, 2, 3
Dynamic
756 N [170 lbf]
1, 3, 4
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
311 N [70 lbf]
1, 4
Tensile
111 N [25 lbf]
2, 4
Torque
3.95 N-m [35 lbf-in]
3, 4