Intel Core 2 Quad Q8200 BX80570Q8200 User Manual
Product codes
BX80570Q8200
Thermal Specifications and Design Considerations
76
Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
. In all cases the Thermal Monitor or
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
NOTES:
1.
1.
Specification is at 37° C Tc and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
design characterization and not 100% tested.
2.
Specification is at 34° C Tc and minimum voltage loadline. Specification is
ensured
by design
characterization and not 100% tested.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
The TDP is not the maximum power that the processor can dissipate.
4.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
may have a lower TDP. Therefore, the maximum T
C
will vary depending on the TDP of the
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and T
combinations of power and T
C
.
5.
775_VR_CONFIG_05 guidelines provide a design target for meeting future thermal
requirements.
requirements.
6.
These processors have CPUID = 1067Ah.
7.
These processors have CPUID = 10677h.
8.
These processors have CPUID = 10676h.
Table 5-1.
Processor Thermal Specifications
Processor
Number
Core
Freq.
(GHz)
Thermal
Design
Power
(W)
3, 4
Extended
HALT
Power
(W)
1
Deeper
Sleep
Power
(W)
2
775_VR_CO
NFIG
5
Minimum
T
C
(°C)
Maximum T
C
(°C)
Notes
QX9770
3.20
136
16
—
—
5
See
and
8
QX9650
3.00
130
16
—
775_VR_CO
NFIG_05B
5
See
and
7, 8
Q9650
Q9550
Q9550
Q9505
Q9450
Q9400
Q9300
Q8400
Q8300
Q8200
Q9550
Q9550
Q9505
Q9450
Q9400
Q9300
Q8400
Q8300
Q8200
3.0
2.83
2.83
2.83
2.66
2.66
2.50
2.66
2.50
2.33
2.83
2.83
2.66
2.66
2.50
2.66
2.50
2.33
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
8
8
8
—
—
—
—
—
8
—
8
8
8
—
775_VR_CO
NFIG_05A
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
See
and
6
6
7
7
7
6
7
6
6
7
6
7
7
7
6
7
6
6
7
Q9550S
Q9505S
Q9400S
Q8400S
Q8200S
Q9505S
Q9400S
Q8400S
Q8200S
2.83
2.83
2.66
2.66
2.33
2.83
2.66
2.66
2.33
65
65
65
65
65
65
65
65
65
12
12
12
12
12
12
12
12
12
8
8
8
8
8
8
8
8
8
775_VR_CO
NFIG_06
5
5
5
5
5
5
5
5
5
See
and
6
6
6
6
6
6
6
6
6