Intel Core 2 Quad Q8200 BX80570Q8200 User Manual

Product codes
BX80570Q8200
Page of 104
Datasheet
101
Boxed Processor Specifications
If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin 
motherboard header and the motherboard is designed with a fan speed controller with 
PWM output (CONTROL see 
) and remote thermal diode measurement 
capability the boxed processor will operate as follows:
As processor power has increased the required thermal solutions have generated 
increasingly more noise. Intel has added an option to the boxed processor that allows 
system integrators to have a quieter system in the most common usage.
The 4th wire PWM solution provides better control over chassis acoustics. This is 
achieved by more accurate measurement of processor die temperature through the 
processor's Digital Thermal Sensors (DTS) and PECI. Fan RPM is modulated through the 
use of an ASIC located on the motherboard that sends out a PWM control signal to the 
4th pin of the connector labeled as CONTROL. The fan speed is based on actual 
processor temperature instead of internal ambient chassis temperatures.
If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard 
processor fan header it will default back to a thermistor controlled mode, allowing 
compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode, 
the fan RPM is automatically varied based on the Tinlet temperature measured by a 
thermistor located at the fan inlet.
For more details on specific motherboard requirements for 4-wire based fan speed 
control see the appropriate Thermal and Mechanical Design Guidelines (See 
7.5
Boxed Intel
®
 Core™2 Extreme Processor QX9650 
Specifications
This section documents the mechanical specifications of the Boxed Intel
®
 Core™2 
Extreme processor QX9650. The boxed processor will be shipped with an unattached 
shows a mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper 
cooling. The physical space requirements and dimensions for the boxed processor with 
assembled fan heatsink are shown in 
 
(top view), and 
 
(side view). 
The airspace requirements for the boxed processor fan heatsink must also be 
incorporated into new baseboard and system designs. Airspace requirements are 
and 
. Note that some figures have centerlines shown 
(marked with alphabetic designations) to clarify relative dimensioning.
Note:
The Boxed Intel
®
 Core™2 Extreme processor QX9650 cooling solution violates the 
boxed processor keep out zones. This is done intentionally, and with the understanding 
that Extreme Edition systems will be integrated into larger capacity chassis.