Intel C2550 FH8065401488912 Data Sheet

Product codes
FH8065401488912
Page of 746
Volume 2—Thermal Management—C2000 Product Family
Processor Thermal Control Circuit (TCC) Mechanisms
Intel
®
 Atom™ Processor C2000 Product Family for Microserver
Datasheet, Vol. 2 of 3
September 2014
150
Order Number: 330061-002US
8.6
Processor Thermal Control Circuit (TCC) Mechanisms
Thermal Control Circuit (TCC) mechanisms are implemented to reduce temperature by 
reducing power consumption in response to a Core HOT condition. The core implements 
Intel
®
 Thermal Monitor 1 (TM1) clock modulation similar to legacy devices and Intel
®
 
Thermal Monitor 2 (TM2) core frequency/voltage reduction. All thermal control circuit 
mechanisms are controlled via P-Unit routines. 
8.6.1
Clock Modulation (Intel
®
 Thermal Monitor 1)
Intel
®
 Thermal Monitor 1 (TM1) effectively stops the core clock periodically to reduce 
processor power consumption. The duration for which the clock is modulated is 
programmable within each core register. The on/off duty-cycle is adjusted in 
increments of 12.5% and must be configured by the BIOS. 
Note:
The stop-clock duration is frequency dependent and higher frequencies stop the clock 
for shorter durations for a given duty-cycle configuration.
TM1 is enabled via each core register and activated as a secondary control mechanism 
if TM2 (described below) is unsuccessful at reducing processor temperatures for a 
period of time.
8.6.2
Core Frequency/Voltage Reduction (Intel
®
 Thermal Monitor 2)
The core implements an adaptive Intel
®
 Thermal Monitor 2 (TM2) mechanism which 
transitions to a lower operating frequency and voltage Low Frequency Mode (LFM). The 
core implements this mechanism only if higher performance frequency and voltage 
points are not successful in reducing temperatures (i.e., chooses the highest 
performance operating point which reduces processor temperatures). 
Intel
®
 Thermal Monitor 2 is automatically selected as the primary thermal control 
mechanism and selection of LFM versus adaptive mode is achieved via the thermal 
configuration registers.
8.6.3
Thermal Status
Thermal trip events are captured in status registers. Associated with each event is a set 
of programmable actions. For a complete list of refer to the Avoton/Rangeley SoC BIOS 
Writer’s Guide (BWG)
.