Intel C2550 FH8065401488912 Data Sheet

Product codes
FH8065401488912
Page of 746
Intel
®
 Atom™ Processor C2000 Product Family for Microserver
September 2014
Datasheet, Vol. 3 of 3
Order Number: 330061-002US
583
Volume 3—Signal Names and Descriptions—C2000 Product Family
System DDR Memory Signals
DDR3_1_BS[2:0]
O
DDR
3
VDDR
DDR3 Bank Select: Defines 
which banks are being 
addressed within each rank. 
BA0 - BA2 define to which 
bank an Active, Read, Write or 
Pre-charge command is being 
applied (for 256 MB and 512 
MB, BA2 is not applied). The 
Bank address also determines 
if the mode register or one of 
the extended mode registers 
is to be accessed during an 
MRS or EMRS command cycle.
DDR3_1_DQPU
I/O
DDR
1
VDDR
DDR3 Compensation Pad. 
Board trace + External 
Precision resistor = 35. The 
resistor is pulled-down to 
VSS.
DDR3_1_CMDPU
I/O
DDR
1
VDDR
DDR3 Compensation Pad. 
Board trace + External 
Precision resistor = 24 or 33.5 
depending on target RON. The 
resistor is pulled-down to 
VSS.
DDR3_1_MON1P
I/O
DDR
1
VDDR
DDR3 PLL Monitor Port1.
DDR3_1_MON1N
I/O
DDR
1
VDDR
DDR3 PLL Monitor Port1.
DDR3_1_MON2P
I/O
DDR
1
VDDR
DDR3 PLL Monitor Port2.
DDR3_1_MON2N
I/O
DDR
1
VDDR
DDR3 PLL Monitor Port2.
DDR3_1_REFP
I
DDR
1
VDDR
DDRIO MPLL Input Reference 
Clock.
• For SKU 8, this input is 
connected to VSS on the 
platform board.
DDR3_1_REFN
I
DDR
1
VDDR
DDRIO MPLL Input Reference 
Clock.
• For SKU 8, this input is 
connected to VSS on the 
platform board.
DDR3_1_DQECC[7:0]
I/O
DDR
8
VDDR
DDR3 ECC Bus: Memory Error 
Correction Code driven along 
with read and write data.
TOTAL
145
Table 31-5. DDR1 Signals (Sheet 5 of 5)
Signal Name
I/O 
Type
I/O Buffer 
Type
Ball 
Count
Internal 
Resistor 
PU/PD
External 
Resistor 
PU/PD
Power 
Rail
Description