Intel C2518 FH8065501516710 Data Sheet

Intel

®

 Atom™ Processor C2000 Product Family for Microserver

Datasheet, Vol. 2 of 3

September 2014

144

Order Number: 330061-002US

The SoC implements configurable forms of thermal management for itself, memory, 

and the system. The architecture implements various proven methods of maintaining 

maximum performance while remaining within thermal specifications. Thermal Control 

Circuit (TCC) mechanisms are used to reduce power consumption when thermal device 

limits are exceeded and the system is notified of this condition via interrupts or thermal 

signaling pins.

Thermal management features include:

• Up to 15 Digital Thermal Sensors (DTS) per SoC

— Three sensors per two-core module
— Three uncore sensors

• Four (4) thermal interrupt triggers per sensor

— Hot, critical, and two programmable thresholds

• PROCHOT_B, MEMHOT_B, and THERMTRIP_N
• Thermal Control Circuit (TCC) mechanisms

— Bi-directional PROCHOT_B
— Intel

®

 Thermal Monitor 1

— Intel

®

 Thermal Monitor 2

• Thermal monitoring and actions managed by the SoC
• Closed-Loop Thermal Throttling (CLTT) pass-through
• Temperature provided by the BMC or other external circuitry via PECI over SMBus
• Memory  thermal  control
• Fan Speed Control (FSC) parameter (T

control

)

The functional description for PECI over the integrated SMBus is in 

5.0

December 6, 

2011

, 

Revision 5.0