Intel C2518 FH8065501516710 Data Sheet

Intel

®

 Atom™ Processor C2000 Product Family for Microserver

September 2014

Datasheet, Vol. 3 of 3

Order Number: 330061-002US

689

For proper functional operation, all processor electrical and thermal requirements must 

be satisfied. These are shown starting with 

.

When the device is subjected to conditions outside the functional operation condition 

limits, but within absolute maximum and minimum ratings, neither functionality nor 

long-term reliability can be expected. If a device is returned to conditions within 

functional operation limits after having been subjected to conditions outside these 

limits, but within the absolute maximum and minimum ratings, the device may be 

functional, but with its lifetime degraded depending on exposure to conditions 

exceeding the functional operation condition limits.

At conditions exceeding absolute maximum and minimum ratings, neither functionality 

nor long-term reliability can be expected. Moreover, if a device is subjected to these 

conditions for any length of time, it will either not function or its reliability will be 

severely degraded when returned to conditions within the functional operating 

condition limits.

This section applies to the component-level storage prior to board attach. 

Environmental storage condition limits define the temperature and relative humidity to 

which the device is exposed to while being stored in the applicable Intel shipping media 

trays, reels, and moisture barrier bags and boxes, and the component is not electrically 

connected.

 specifies absolute maximum and minimum storage temperature and 

humidity limits for given time durations. Failure to adhere to the specified limits could 

result in physical damage to the component. If this is suspected, Intel recommends a 

visual inspection to determine possible physical damage to the silicon or surface 

components.

1.

Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount 

re-flow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.

2.

Component product device storage temperature qualification methods may follow JESD22-A119 (low 

temperature) and JESD22-A103 (high temperature) standards when applicable for volatile memory.

3.

Component stress testing is conducted in conformance with JESD22-A104.

4.

The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture 

sensitive devices removed from the moisture barrier bag.

T

absolute storage

Device storage temperature when exceeded 

for any length of time. 

-25

125

°C

T

sustained storage time and 

temperature

The minimum/maximum device storage 

temperature for a sustained period of time.

-5

40

°C

T

short term storage

The ambient storage temperature and time for 

up to 72 hours.

-25

85

°C

RH

sustained storage

The maximum device storage relative 

humidity for up to 30 months.

60% at 

24 °C